Content Inside :
Senior Director Design Methodology
Business Group Automotive, Industrial & Multimarket
Automotive Microelectronics Trends ? More Than 50% of $-value of Electronics is Semiconductors
Full spectrum of semi-conductor technologies is needed
While technologies for Automotive follow at a distance
Year of Production
Technology Node – Minimum structure (nm)
1. Extended Temperature Range: -50° C to 175+° C
2. Extreme mechanical stress (vibration, pressure, temp. cycles)
7. Zero Defect Requirement
3. Extreme voltages/currents for Power-Semiconductors (Switches)
4. Long term reliability requirement
5. Large eFlash with 10 years data stability
6. Demanding ESD / EMC / EOS requirements
The special challenges for Automotive Technologies
Today’s EDA Tools provide “sub-optimal” Support for:
Our today’s “Top 3 Challenges” (w/o good EDA solutions)
A typical Infineon High-End µC
The eFlash challenges:
1. Tremendous analogue complexity pushing the tool limits ( 18 Mio Transistors ? 100 Mio extr. Devices)
2. Complex Mixed Signal function; FSI with own CPU for calibration
3. Electro-Migration verification
4. Dynamic IR Drop verification
5. Hierarchical Extraction
6. True Latchup Issues (due to high Voltages during write/erase)
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